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| PMST3906 40 V, 200 mA PNP switching transistor Rev. 05 -- 29 April 2009 Product data sheet 1. Product profile 1.1 General description PNP switching transistor in a SOT323 (SC-70) very small Surface-Mounted Device (SMD) plastic package. NPN complement: PMST3904. 1.2 Features I Collector current: IC -200 mA I Collector-emitter voltage: VCEO -40 V I Very small SMD plastic package 1.3 Applications I General amplification and switching 1.4 Quick reference data Table 1. Symbol VCEO IC Quick reference data Parameter collector-emitter voltage collector current Conditions open base Min Typ Max -40 -200 Unit V mA 2. Pinning information Table 2. Pin 1 2 3 Pinning Description base emitter collector 1 2 3 1 2 sym013 Simplified outline Graphic symbol 3 NXP Semiconductors PMST3906 40 V, 200 mA PNP switching transistor 3. Ordering information Table 3. Ordering information Package Name PMST3906 SC-70 Description plastic surface-mounted package; 3 leads Version SOT323 Type number 4. Marking Table 4. PMST3906 [1] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China Marking codes Marking code[1] *2A Type number 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCBO VCEO VEBO IC ICM IBM Ptot Tj Tamb Tstg [1] Parameter collector-base voltage collector-emitter voltage emitter-base voltage collector current peak collector current peak base current total power dissipation junction temperature ambient temperature storage temperature Conditions open emitter open base open collector single pulse; tp 1 ms single pulse; tp 1 ms Tamb 25 C [1] Min -65 -65 Max -40 -40 -6 -200 -200 -100 200 150 +150 +150 Unit V V V mA mA mA mW C C C Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. 6. Thermal characteristics Table 6. Symbol Rth(j-a) [1] Thermal characteristics Parameter thermal resistance from junction to ambient Conditions in free air [1] Min - Typ - Max 625 Unit K/W Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. PMST3906_5 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 05 -- 29 April 2009 2 of 10 NXP Semiconductors PMST3906 40 V, 200 mA PNP switching transistor 7. Characteristics Table 7. Characteristics Tamb = 25 C unless otherwise specified. Symbol ICBO IEBO hFE Parameter Conditions Min Typ Max -50 -50 Unit nA nA collector-base cut-off IE = 0 A; VCB = -30 V current emitter-base cut-off current DC current gain IC = 0 A; VEB = -6 V VCE = -1 V IC = -0.1 mA IC = -1 mA IC = -10 mA IC = -50 mA IC = -100 mA VCEsat VBEsat td tr ton ts tf toff Cc Ce collector-emitter saturation voltage base-emitter saturation voltage delay time rise time turn-on time storage time fall time turn-off time collector capacitance IE = ie = 0 A; VCB = -5 V; f = 1 MHz emitter capacitance IC = ic = 0 A; VEB = -500 mV; f = 1 MHz IC = -10 mA; VCE = -20 V; f = 100 MHz IC = -100 A; VCE = -5 V; RS = 1 k; f = 10 Hz to 15.7 kHz IC = -10 mA; IB = -1 mA IC = -50 mA; IB = -5 mA IC = -10 mA; IB = -1 mA IC = -50 mA; IB = -5 mA IC = -10 mA; IBon = -1 mA; IBoff = 1 mA 60 80 100 60 30 300 -250 -400 -850 -950 35 35 70 225 75 300 4.5 10 mV mV mV mV ns ns ns ns ns ns pF pF fT transition frequency 250 - - MHz NF noise figure - - 4 dB PMST3906_5 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 05 -- 29 April 2009 3 of 10 NXP Semiconductors PMST3906 40 V, 200 mA PNP switching transistor 600 hFE (1) mhc459 -250 IC (mA) -200 006aab475 IB (mA) = -1.5 -1.35 -1.20 -1.05 -0.75 400 -150 -0.90 -0.60 (2) -100 -0.45 200 (3) -0.30 -50 -0.15 0 -10-1 -1 -10 -102 IC (mA) -103 0 0 -2 -4 -6 -8 -10 VCE (V) VCE = -1 V (1) Tamb = 150 C (2) Tamb = 25 C (3) Tamb = -55 C Tamb = 25 C Fig 1. DC current gain as a function of collector current; typical values mhc461 Fig 2. Collector current as a function of collector-emitter voltage; typical values mhc462 -1200 VBE (mV) -1000 (1) -1200 VBEsat (mV) -1000 (1) -800 (2) -800 (2) -600 (3) -600 (3) -400 -400 -200 -10-1 -1 -10 -102 IC (mA) -103 -200 -10-1 -1 -10 -102 IC (mA) -103 VCE = -1 V (1) Tamb = -55 C (2) Tamb = 25 C (3) Tamb = 150 C IC/IB = 10 (1) Tamb = -55 C (2) Tamb = 25 C (3) Tamb = 150 C Fig 3. Base-emitter voltage as a function of collector current; typical values Fig 4. Base-emitter saturation voltage as a function of collector current; typical values PMST3906_5 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 05 -- 29 April 2009 4 of 10 NXP Semiconductors PMST3906 40 V, 200 mA PNP switching transistor -103 VCEsat (mV) mhc463 (1) -102 (2) (3) -10 -10-1 -1 -10 -102 IC (mA) -103 IC/IB = 10 (1) Tamb = 150 C (2) Tamb = 25 C (3) Tamb = -55 C Fig 5. Collector-emitter saturation voltage as a function of collector current; typical values 8. Test information VBB VCC RB (probe) oscilloscope 450 VI R1 R2 RC Vo (probe) 450 DUT oscilloscope mgd624 VI = 5 V; t = 500 s; tp = 10 s; tr = tf 3 ns R1 = 56 ; R2 = 2.5 k; RB = 3.9 k; RC = 270 VBB = 1.9 V; VCC = -3 V Oscilloscope: input impedance ZI = 50 Fig 6. Test circuit for switching times PMST3906_5 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 05 -- 29 April 2009 5 of 10 NXP Semiconductors PMST3906 40 V, 200 mA PNP switching transistor 9. Package outline 2.2 1.8 3 0.45 0.15 1.1 0.8 2.2 1.35 2.0 1.15 1 2 0.4 0.3 1.3 0.25 0.10 04-11-04 Dimensions in mm Fig 7. Package outline SOT323 (SC-70) 10. Packing information Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number PMST3906 [1] Package Description SOT323 4 mm pitch, 8 mm tape and reel Packing quantity 3000 -115 10000 -135 For further information and the availability of packing methods, see Section 14. PMST3906_5 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 05 -- 29 April 2009 6 of 10 NXP Semiconductors PMST3906 40 V, 200 mA PNP switching transistor 11. Soldering 2.65 1.85 1.325 solder lands 2 solder resist solder paste occupied area Dimensions in mm 2.35 0.6 (3x) 3 1.3 0.5 (3x) 1 0.55 (3x) sot323_fr Fig 8. Reflow soldering footprint SOT323 (SC-70) 4.6 2.575 1.425 (3x) solder lands solder resist occupied area 3.65 2.1 1.8 Dimensions in mm preferred transport direction during soldering 09 (2x) sot323_fw Fig 9. Wave soldering footprint SOT323 (SC-70) PMST3906_5 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 05 -- 29 April 2009 7 of 10 NXP Semiconductors PMST3906 40 V, 200 mA PNP switching transistor 12. Revision history Table 9. Revision history Release date 20090429 Data sheet status Product data sheet Change notice Supersedes PMST3906_4 Document ID PMST3906_5 Modifications: * * * * * * * The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Figure 2: updated Figure 5: figure notes order amended Section 10 "Packing information" added Section 11 "Soldering": added Section 13 "Legal information": updated Product specification Product specification Product specification PMST3906_3 PMST3906_CNV_2 - PMST3906_4 PMST3906_3 PMST3906_CNV_2 20040121 19990422 19970527 PMST3906_5 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 05 -- 29 April 2009 8 of 10 NXP Semiconductors PMST3906 40 V, 200 mA PNP switching transistor 13. Legal information 13.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 13.3 Disclaimers General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com PMST3906_5 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 05 -- 29 April 2009 9 of 10 NXP Semiconductors PMST3906 40 V, 200 mA PNP switching transistor 15. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics. . . . . . . . . . . . . . . . . . . 2 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 5 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 Packing information. . . . . . . . . . . . . . . . . . . . . . 6 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Contact information. . . . . . . . . . . . . . . . . . . . . . 9 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'. (c) NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 29 April 2009 Document identifier: PMST3906_5 |
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